63/37 SOLDER PASTE, 50G JAR

CAT# SMD-291
$19.50 each
Quantity:  
 
ChipQuik® SMD291AX50T3
Alloy: Sn63/Pb37
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 90.25% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 183C (361F)
Size: 50g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
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