SOLDERLESS BREADBOARD, 170 CONTACTS

170 Contacts. 1.80" x 1.40" x 0.375" high. Design and change circuits quickly and cleanly. Accommodates all sizes of dips and discrete components with lead diameters up to 0.032". Interconnect with solid hook-up wire (#22 AWG recommended). Wires and components can be used and re-used many times without damage to board or components.