ChipQuik# SMD291AX. Solder paste, no clean, 63Sn/37Pb in 5cc syringe. 15g. With plunger and tip.
Alloy: Sn63/Pb37
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 88% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 183C (361F)
Size: 5cc/15g syringe
Shelf LifeRefrigerated >12 months, unrefrigerated >6 months
Stencil Life>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil CleaningAutomated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and HandlingRefrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.