ChipQuik® SMDLTLFP. Solder Paste Sn42/Bi58. No clean. Lead-free. Low temperature melting point. For lead and lead-free applications.
Alloy: Sn42/Bi58
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 87% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 138C (281F)
Size: 5cc/15g syringe
Shelf Life
Refrigerated >6 months, unrefrigerated >2 months.
Note: Guaranteed for 12 months from date of manufacture, regardless of refrigeration.
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
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