Designed for a wide range of applications including high-power CPUs, GPUs and high-performance heatsinks or water-cooling solutions.
Specifications:• Thermal Conductivity: 5.15 W/mK
• Weight: 1 gram
• Thermal Impedance: <0.004*C-IN2/W
• Viscosity: 12500
• Concentration: 330±101/10MM
• Working Temperature: -30 to 280°C
• Silicon Compound: 10%
• Carbon Compound: 45%
• Oxidized Metal Compound: 45%
